Metzler, Meredith
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Publication Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Tetrafluoromethane (CF4)(2016-05-07) Metzler, MeredithThis report discusses the CF4 etch process of SiNx using the Oxford 80 Plus RIE.Publication Reactive Ion Etch (RIE) of Silicon and ZEP520A Resist Mask with Tetrafluoromethane (CF4) Using Oxford 80 Plus(2016-05-12) Wood, Steven; Lopez, Gerald G; Metzler, MeredithThis report discusses the results of etching silicon with electron beam lithography defined features in ZEP520A resist using CF4 in the Oxford 80 Plus RIE.Publication Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Trifluoromethane and Oxygen (CHF3/O2)(2016-05-07) Metzler, MeredithThis report discusses the CHF3/O2 etch process of SiNx using the Oxford 80 Plus RIE.Publication Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Nitride (SiNx) Using Oxford Instruments System 100 PECVD(2017-02-28) Metzler, Meredith; Patel, RajThis report discusses the deposition process of SiNx using the Oxford System 100 PECVD.Publication Atomic Layer Deposition (ALD) film characterization(2016-04-28) Metzler, Meredith; Lu, YichenThis report shows deposition characteristics for aluminum oxide (Al2O3), hafnium oxide (HfO2), and titanium dioxide (TiO2) films deposited in the Cambridge Nanotech Savannah system. A brief study of the presence of pinholes in these films is also presented.Publication Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide (SiO2) Using Oxford Instruments System 100 PECVD(2017-02-07) Metzler, Meredith; Patel, RajThis report discusses the deposition process of SiO2 using the Oxford System 100 PECVD.Publication Reactive Ion Etch (RIE) of Silicon Dioxide (SiO2) with Tetrafluoromethane (CF4)(2016-05-07) Metzler, MeredithThis report discusses the CF4 etch process of SiO2 using the Oxford 80 Plus RIE.Publication Characterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIE(2016-10-06) Azadi, Mohsen; Metzler, Meredith; Lopez, Gerald GThis technical report describes the process of etching silicon dioxide (SiO2) and Microchem S1800 resist using the Oxford 80 Plus Reactive Ion Etch (RIE) system.Publication Publication Characterization of Sputtering Copper Using the Denton Explorer-14 System(2017-03-10) Mays, Roman; Metzler, Meredith