Characterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIE
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Protocols and Reports
Quattrone Nanofabrication Facility
Quattrone Nanofabrication Facility
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Nanoscience and Nanotechnology
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This technical report describes the process of etching silicon dioxide (SiO2) and Microchem S1800 resist using the Oxford 80 Plus Reactive Ion Etch (RIE) system.
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2016-10-06