Effect of Post-Development Bake on Adhesion of SU-8

Contributor

Abstract

To test adhesion of under-exposed SU-8 structures with the wafer surface by Post-Development (PD) Bake.

Advisor

Date Range for Data Collection (Start Date)

Date Range for Data Collection (End Date)

Digital Object Identifier

Series name and number

Publication date

2017-07-14

Volume number

Issue number

Publisher

Publisher DOI

relationships.isJournalIssueOf

Comments

Recommended citation

Collection