Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater
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Quattrone Nanofabrication Facility
Quattrone Nanofabrication Facility
Degree type
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Subject
Photoresist
S1805
thickness
spray coater
Suss MicroTec AS8
Alta Spray
Aerospace Engineering
Applied Mechanics
Automotive Engineering
Biochemical and Biomolecular Engineering
Biomechanical Engineering
Biomedical
Biomedical Engineering and Bioengineering
Electrical and Computer Engineering
Electrical and Electronics
Electromagnetics and Photonics
Electro-Mechanical Systems
Electronic Devices and Semiconductor Manufacturing
Engineering Mechanics
Mechanics of Materials
Nanoscience and Nanotechnology
Nanotechnology Fabrication
Other Engineering Science and Materials
VLSI and Circuits, Embedded and Hardware Systems
S1805
thickness
spray coater
Suss MicroTec AS8
Alta Spray
Aerospace Engineering
Applied Mechanics
Automotive Engineering
Biochemical and Biomolecular Engineering
Biomechanical Engineering
Biomedical
Biomedical Engineering and Bioengineering
Electrical and Computer Engineering
Electrical and Electronics
Electromagnetics and Photonics
Electro-Mechanical Systems
Electronic Devices and Semiconductor Manufacturing
Engineering Mechanics
Mechanics of Materials
Nanoscience and Nanotechnology
Nanotechnology Fabrication
Other Engineering Science and Materials
VLSI and Circuits, Embedded and Hardware Systems
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Abstract
S1805 positive photoresist has been deposited on single crystalline Si wafers using a Suss MicroTec Alta Spray. The influence of flow rate, nozzle speed, pitch and number of passes on the thickness of the photoresist was studied. Results show that the thickness of S1805 is linearly proportional to the flow rate and number of passes, and inversely proportional to the nozzle speed and pitch.
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2019-10-15