Protocols and Reports

Document Type

Technical Report

Date of this Version

2-10-2021

Facility

Quattrone Nanofabrication Facility

Abstract

We report on the process protocol to cleave wafers using LatticeGear cleaving and scribing tools sets.

Keywords

LatticeGear, wafer scribing, wafer cleaving, silicon fracture

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Date Posted: 10 February 2021

This document has been peer reviewed.

 

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