Protocols and Reports
Document Type
Technical Report
Date of this Version
2-10-2021
Facility
Quattrone Nanofabrication Facility
Abstract
We report on the process protocol to cleave wafers using LatticeGear cleaving and scribing tools sets.
Keywords
LatticeGear, wafer scribing, wafer cleaving, silicon fracture
Included in
Biological Engineering Commons, Biomechanical Engineering Commons, Electrical and Electronics Commons, Electromagnetics and Photonics Commons, Electro-Mechanical Systems Commons, Electronic Devices and Semiconductor Manufacturing Commons, Engineering Education Commons, Engineering Science and Materials Commons, Nanotechnology Fabrication Commons, Semiconductor and Optical Materials Commons, Systems and Integrative Engineering Commons, VLSI and Circuits, Embedded and Hardware Systems Commons
Date Posted: 10 February 2021
This document has been peer reviewed.