How to cleave wafers: LatticeGear protocol
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Protocols and Reports
Quattrone Nanofabrication Facility
Quattrone Nanofabrication Facility
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LatticeGear
wafer scribing
wafer cleaving
silicon fracture
Biological Engineering
Biomechanical Engineering
Electrical and Computer Engineering
Electrical and Electronics
Electromagnetics and Photonics
Electro-Mechanical Systems
Electronic Devices and Semiconductor Manufacturing
Engineering
Engineering Education
Engineering Science and Materials
Materials Science and Engineering
Mechanical Engineering
Nanotechnology Fabrication
Semiconductor and Optical Materials
Systems and Integrative Engineering
VLSI and Circuits, Embedded and Hardware Systems
wafer scribing
wafer cleaving
silicon fracture
Biological Engineering
Biomechanical Engineering
Electrical and Computer Engineering
Electrical and Electronics
Electromagnetics and Photonics
Electro-Mechanical Systems
Electronic Devices and Semiconductor Manufacturing
Engineering
Engineering Education
Engineering Science and Materials
Materials Science and Engineering
Mechanical Engineering
Nanotechnology Fabrication
Semiconductor and Optical Materials
Systems and Integrative Engineering
VLSI and Circuits, Embedded and Hardware Systems
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Abstract
We report on the process protocol to cleave wafers using LatticeGear cleaving and scribing tools sets.
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Publication date
2021-02-10