Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater
Date of this Version
Quattrone Nanofabrication Facility
S1805 positive photoresist has been deposited on single crystalline Si wafers using a Suss MicroTec Alta Spray. The inﬂuence of ﬂow rate, nozzle speed, pitch and number of passes on the thickness of the photoresist was studied. Results show that the thickness of S1805 is linearly proportional to the ﬂow rate and number of passes, and inversely proportional to the nozzle speed and pitch.
Photoresist, S1805, thickness, spray coater, Suss MicroTec AS8, Alta Spray
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Date Posted: 15 October 2019
This document has been peer reviewed.