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Working Paper

Date of this Version



Quattrone Nanofabrication Facility


S1805 positive photoresist has been deposited on single crystalline Si wafers using a Suss MicroTec Alta Spray. The influence of flow rate, nozzle speed, pitch and number of passes on the thickness of the photoresist was studied. Results show that the thickness of S1805 is linearly proportional to the flow rate and number of passes, and inversely proportional to the nozzle speed and pitch.


Photoresist, S1805, thickness, spray coater, Suss MicroTec AS8, Alta Spray



Date Posted: 15 October 2019

This document has been peer reviewed.


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