Tool Data
Document Type
Working Paper
Date of this Version
10-15-2019
Facility
Quattrone Nanofabrication Facility
Abstract
S1805 positive photoresist has been deposited on single crystalline Si wafers using a Suss MicroTec Alta Spray. The influence of flow rate, nozzle speed, pitch and number of passes on the thickness of the photoresist was studied. Results show that the thickness of S1805 is linearly proportional to the flow rate and number of passes, and inversely proportional to the nozzle speed and pitch.
Keywords
Photoresist, S1805, thickness, spray coater, Suss MicroTec AS8, Alta Spray
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Aerospace Engineering Commons, Applied Mechanics Commons, Automotive Engineering Commons, Biochemical and Biomolecular Engineering Commons, Biomechanical Engineering Commons, Biomedical Commons, Biomedical Engineering and Bioengineering Commons, Electrical and Electronics Commons, Electromagnetics and Photonics Commons, Electro-Mechanical Systems Commons, Electronic Devices and Semiconductor Manufacturing Commons, Engineering Mechanics Commons, Mechanics of Materials Commons, Nanoscience and Nanotechnology Commons, Nanotechnology Fabrication Commons, Other Engineering Science and Materials Commons, VLSI and Circuits, Embedded and Hardware Systems Commons
Date Posted: 15 October 2019
This document has been peer reviewed.