Protocols and Reports

Document Type

Working Paper

Date of this Version

1-29-2021

Facility

Quattrone Nanofabrication Facility

Abstract

Bilayer lift-off process for 1μm feature size is demonstrated using LOR 3A and S1813 photoresist. The thickness of photoresists was fixed, whereas development time is varied. The process was further investigated by measuring the undercut depth and undercut rate by scanning electron microscopy. An optimized and reproducible recipe is provided.

Keywords

Lift-off process, Bilayer lift-off process, Photolithography, Patterning, S1813, LOR 3A, Development

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Date Posted: 29 January 2021

This document has been peer reviewed.

 

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