Date of this Version
Quattrone Nanofabrication Facility
Bilayer lift-off process for 1μm feature size is demonstrated using LOR 3A and S1813 photoresist. The thickness of photoresists was fixed, whereas development time is varied. The process was further investigated by measuring the undercut depth and undercut rate by scanning electron microscopy. An optimized and reproducible recipe is provided.
Lift-off process, Bilayer lift-off process, Photolithography, Patterning, S1813, LOR 3A, Development
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Date Posted: 29 January 2021
This document has been peer reviewed.