Protocols and Reports

Document Type

Working Paper

Date of this Version

10-4-2019

Facility

Quattrone Nanofabrication Facility

Abstract

When using Heidelberg DWL66+ laser writer to fabricate the photomask, the pattern feature dimensions may have deviations. These deviations can be caused by the lithography process and the undercut in the metal etch process. The same deviation value of 0.8µm was found to appear in all the patterns independent of the pattern original size and local pattern density. To overcome this universal deviation, a universal bias is suggested to be applied to the original patterns during the data preparation for the lithography process. In order to ensure this pre-exposure bias method can work, both the laser direct-write exposure conditions (laser power, filters, focus parameters) and the metal etch time should be kept consistent.

Keywords

Heidelberg, Laser Direct-Write (LDW), Photomask

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Date Posted:04 October 2019

This document has been peer reviewed.

 

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