Protocols and Reports

Document Type

Technical Report

Date of this Version

10-23-2018

Facility

Quattrone Nanofabrication Facility

Abstract

In photolithography, it is often the case that the resist has difficulty adhering to a wafer due to its hydrophobic nature. The purpose of this study was to determine the best method for avoiding such adhesion problems. This study describes that four different surface treatments, (1) No bake before resist coating, (2) Bake at 115ºC before priming, (3) SURPASS coating, and (4) HDMS priming, are examined for UV lithography of sub-ten micron-sized lines and pillar arrays, and that HDMS vapor priming is the most effective surface treatment in promoting adhesion.

Creative Commons License

Creative Commons Attribution-Share Alike 4.0 License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.

Share

COinS
 

Date Posted: 23 October 2018

 

To view the content in your browser, please download Adobe Reader or, alternately,
you may Download the file to your hard drive.

NOTE: The latest versions of Adobe Reader do not support viewing PDF files within Firefox on Mac OS and if you are using a modern (Intel) Mac, there is no official plugin for viewing PDF files within the browser window.