Protocols and Reports

Document Type

Technical Report

Date of this Version



Quattrone Nanofabrication Facility


This report describes dependence of the inkjet printing on the surface roughness of normal PI film, ultra-smooth PI film, and polished Si wafer. The printing line width and LER are discussed by the line spreading constraint due to the limited volume of the droplet, vaporization of the solvent by the substrate temperature, the contact angle of the ink, and the surface roughness of the substrate. It is also shown that the minimum line width of ~21um is achieved on the Si wafer. Furthermore, the optimization of the substrate temperature for sintering of Ag nanoparticle is discussed.

Creative Commons License

Creative Commons Attribution-Share Alike 4.0 International License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 International License.


Inkjet printing, Ag nanoparticles, surface roughness



Date Posted: 11 April 2018

This document has been peer reviewed.


To view the content in your browser, please download Adobe Reader or, alternately,
you may Download the file to your hard drive.

NOTE: The latest versions of Adobe Reader do not support viewing PDF files within Firefox on Mac OS and if you are using a modern (Intel) Mac, there is no official plugin for viewing PDF files within the browser window.