Protocols and Reports
Document Type
Technical Report
Date of this Version
4-11-2018
Facility
Quattrone Nanofabrication Facility
Abstract
This report describes dependence of the inkjet printing on the surface roughness of normal PI film, ultra-smooth PI film, and polished Si wafer. The printing line width and LER are discussed by the line spreading constraint due to the limited volume of the droplet, vaporization of the solvent by the substrate temperature, the contact angle of the ink, and the surface roughness of the substrate. It is also shown that the minimum line width of ~21um is achieved on the Si wafer. Furthermore, the optimization of the substrate temperature for sintering of Ag nanoparticle is discussed.
Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 International License.
Keywords
Inkjet printing, Ag nanoparticles, surface roughness
Date Posted: 11 April 2018
This document has been peer reviewed.