Document Type

Technical Report

Date of this Version

4-11-2018

Facility

Quattrone Nanofabrication Facility

Abstract

This report describes dependence of the inkjet printing on the surface roughness of normal PI film, ultra-smooth PI film, and polished Si wafer. The printing line width and LER are discussed by the line spreading constraint due to the limited volume of the droplet, vaporization of the solvent by the substrate temperature, the contact angle of the ink, and the surface roughness of the substrate. It is also shown that the minimum line width of ~21um is achieved on the Si wafer. Furthermore, the optimization of the substrate temperature for sintering of Ag nanoparticle is discussed.

Creative Commons License

Creative Commons Attribution-Share Alike 4.0 License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.

Keywords

Inkjet printing, Ag nanoparticles, surface roughness

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Date Posted: 11 April 2018

This document has been peer reviewed.

 

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