Characterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIE

Loading...
Thumbnail Image
Penn collection
Protocols and Reports
Quattrone Nanofabrication Facility
Degree type
Discipline
Subject
Nanoscience and Nanotechnology
Funder
Grant number
License
Copyright date
Distributor
Related resources
Contributor
Abstract

This technical report describes the process of etching silicon dioxide (SiO2) and Microchem S1800 resist using the Oxford 80 Plus Reactive Ion Etch (RIE) system.

Advisor
Date Range for Data Collection (Start Date)
Date Range for Data Collection (End Date)
Digital Object Identifier
Series name and number
Publication date
2016-10-06
Volume number
Issue number
Publisher
Publisher DOI
Journal Issue
Comments
Recommended citation
Collection