Quattrone Nanofabrication Facility

Quattrone Nanofabrication Facility

 

The Quattrone Nanofabrication Facility (QNF), is an open access user facility that provides equipment resources and staff assistance for building devices and structures at the micro- and nanoscale. In addition to supporting academic research, we serve as a regional resource in welcoming all projects from other universities, industry and national laboratories.

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Submissions from 2020

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Thin Dry Silicon Oxide Films Grown by Thermal Oxidation, Manisha Muduli and Hiromichi Yamamoto

Submissions from 2019

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Fabrication of High Aspect Ratio Nanopillars using Metal Assisted Chemical Etching, Rimjhim Chaudhary and Hiromichi Yamamoto

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Fabrication of Organic Thin Film Transistors using Inkjet Printing of PEDOT:PSS, Sourajit Das, Akshaya Venkatakrishnan, Hiromichi Yamamoto, and George Patrick Watson

YES Oven Tutorial: HMDS Vapor Prime, Saarah Hall and Eric D. Johnston

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Characterization and Optimization of Parylene-C deposition process using SCS Parylene coater, Hannah Hastings, Eric D. Johnston, and Gyuseok Kim

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Microfluidics for Medical Research, Eric D. Johnston

LayoutEditor Training: 01 - Introduction, David Jones

LayoutEditor Training: 02 - Upload License & Set Display, David Jones

LayoutEditor Training: 03 - Setting Grid & Zoom, David Jones

LayoutEditor Training: 04 - Drawing Boxes & Active Mode, David Jones

LayoutEditor Training: 05 - Selecting & Deleting Objects, David Jones

LayoutEditor Training: 06 - Properties, David Jones

LayoutEditor Training: 07 - Cells & Circles, David Jones

LayoutEditor Training: 08 - Cell Array, David Jones

LayoutEditor Training: 09 - Paths & Polygons, David Jones

LayoutEditor Training: 10 - Text, David Jones

LayoutEditor Training: 11 - Move/Scale & Copy/Move, David Jones

LayoutEditor Training: 12 - Layers, Part 1, David Jones

LayoutEditor Training: 13 - Layers, Part 2, David Jones

LayoutEditor Training: 14 - Integrated Practice, David Jones

LayoutEditor Training: 15 - Bonus #1 - MA6 Alignment Marks, David Jones

LayoutEditor Training: 16 - Bonus #2 - ABM Alignment Marks, David Jones

LayoutEditor Training: 17 - Bonus #3 - Boolean Ops, David Jones

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Progress Report I: Fabrication of Nanopores in Silicon Nitride Membranes using Self-Assembly of PS-b-PMMA, Unnati Joshi, Vishal Venkatesh, and Hiromichi Yamamoto

Suss MicroTec MA6 Mask Aligner Training: First Mask, Ifeoluwa Popoola and Eric D. Johnston

Training Video for Using Long-Pass Filter on Suss MicroTec MA6 Mask Aligner, Ifeoluwa Popoola and Eric D. Johnston

Post-process Protocol of Photomask for UV lithography: Wet etch and Strip, Ifeoluwa Popoola and David Jones

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Influence of NaOH Concentration on Transfer Process of Graphene, Francisco Saldana, Chengyu Wen, and George Patrick Watson

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Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater, Rohan Sanghvi and Gyuseok Kim

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Effect of Annealing on the Contact Resistance of Aluminum on a p-type Substrate, Shrey Shah and George Patrick Watson

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Optimization of Ultrasonic Aluminum Wire Bonding on Chromium and Gold Surfaces Using K&S Wedge Wire Bonder, Ryan Tetro and Gyuseok Kim

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Progress Report II: Fabrication of Nanopores in Silicon Nitride Membrane using Self-Assembly of PS-b-PMMA: Nanopore Pattern Transfer to the Si substrate, Kodai Watanabe, Unnati Joshi, and Hiromichi Yamamoto

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Correction of pattern size deviations in the fabrication of photomasks made with a laser direct-writer, Ningzhi Xie and George Patrick Watson

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Dynamics of Directed Self-Assembly of PS-b-PMMA during Solvent Annealing, Hiromichi Yamamoto

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Reactive Ion Etching Selectivity of Si/SiO2: Comparing of two fluorocarbon gases CHF3 and CF4, Meiyue Zhang and Pat Watson

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CdSe Quantum Dots Synthesis Laboratory Course for High School Students, Danlin Zuo, Gyuseok Kim, and David Jones

Submissions from 2018

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CSAR 62 Spin Curve, Mohsen Azadi, Georgia Griggs, Glen de Villafranca, and Gerald Lopez

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Comparison between Silicon Nanopillars Prepared by Bosch Process and Metal Assisted Chemical Etching, Rimjhim Chaudhary

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Surface Roughness Dependence of Inkjet Printing of Ag Nanoparticles, Ming Yuan Chuang

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Surface Treatment and Adhesion Study, Maegan DeLessio and Pat Watson

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Alignment Error Examination of Elionix E-Beam Writer ELS-7500EX, Yangshanshan Li

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DisCharge: Spin-On Anti-Charging Agent for Electron Beam Lithography, Gerald G. Lopez Ph.D. and Glen de Villafranca

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KMPR Master Fabrication Protocol, Justin Wen

Submissions from 2017

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Inkjet Printing of Ag Nanoparticles using Dimatix Inkjet Printer, No 1, Amal Abbas and Inayat Bajwa

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CSAR 62 Contrast Curves, Mohsen Azadi, Georgia Griggs, Glen de Villafranca, and Gerald Lopez

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MicroChem S1818 Contrast Curve Optimization, Mohsen Azadi and Gerald Lopez

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Inkjet Printing of Ag Nanoparticles using Dimatix Inkjet Printer, No 2, Ming Yuan Chuang

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Mask Flaw Propagation Using 360nm Long Pass Filter, Ram Surya Gona and Eric D. Johnston

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SU-8 Post Development Bake (Hard Bake) Study, Ram Surya Gona and Eric D. Johnston

Video Tutorial for ABM Mask Aligner, Including Alignment, Ram Surya Gona and Abhishek Kalpattu

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Effect of Post-Development Bake on Adhesion of SU-8, Eric D. Johnston and Ram Surya Gona

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PDMS Shrinkage, Abhishek Kalpattu

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Characterization of Sputtering Platinum Using the Denton Explorer-14 System, Roman Mays

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Examination of the Stoney Equation and a Practical Determination of the Error in Residual Film Stress Measurements, Roman Mays

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The Measurement of Residual Film Stress in Deposited Thin Films Using the KLA-Tencor 2D/3D P7 Surface Profilometer, Roman Mays

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Characterization of Sputtering Copper Using the Denton Explorer-14 System, Roman Mays and Meredith Metzler

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Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide (SiO2) Using Oxford Instruments System 100 PECVD, Meredith Metzler and Raj Patel

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Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Nitride (SiNx) Using Oxford Instruments System 100 PECVD, Meredith Metzler and Raj Patel

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Optimization of Plasma Enhanced Chemical Vapor Deposition (PECVD) of Amorphous Silicon (a-Si) Using Oxford Instruments System 100 with Taguchi L9 Based Design of Experiments (DOE), Raj Patel and Meredith Metzler

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Troubleshooting on the sample preparation for SU-8 to SU-8 wafer level bonding, Samagata Sen, Saurav Bose, and Shubham Sethi

Submissions from 2016

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Spin Curves for MicroChem S1800 (1805, 1813, 1818) Series Positive Resist, Mohsen Azadi and Gerald G. Lopez

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Characterization of Silicon Deep Reactive Ion Etching Using the SPTS Rapier, Mohsen Azadi, Meredith Metzler, and Gerald G. Lopez

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Characterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIE, Mohsen Azadi, Meredith Metzler, and Gerald G. Lopez

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KOH etching of (100) Si wafer, No 1, Inayat Bajwa

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KOH etching of (100) Si wafer, No 2, Inayat Bajwa

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Metal Assisted Chemical Etching, Inayat Bajwa

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SUSS MicroTec MA6 Gen3 - S1805 Contrast Curve Data, Jonathan Bryan and GERALD G. LOPEZ

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SUSS MicroTec MA6 Gen3 - S1813 Contrast Curve Data, Jonathan Bryan, Steven Wood, and Gerald G. Lopez

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Self-Aligned Double Pattern, No1, Yinong Cao

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High Contrast 50kV E-Beam Lithography for HSQ atop Diamond using ESPACER for Spin-On Charge Dissipation, Richard R. Grote, Lee C. Bassett, and Gerald G. Lopez

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Presentation for Lab-on-a-Chip Seminar at QNF, Eric D. Johnston

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Torrey Pines Scientific Hotplate Calibration, GERALD G. LOPEZ

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ZEP520A Spin Curves and Dilution Characterization, Gerald G. Lopez Ph.D.

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Reactive Ion Etch (RIE) of Silicon Dioxide (SiO2) with Tetrafluoromethane (CF4), Meredith Metzler

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Reactive Ion Etch (RIE) of Silicon Dioxide (SiO2) with Trifluoromethane and Oxygen (CHF3/O2), Meredith Metzler

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Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Tetrafluoromethane (CF4), Meredith Metzler

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Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Trifluoromethane and Oxygen (CHF3/O2), Meredith Metzler

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Atomic Layer Deposition (ALD) film characterization, Meredith Metzler and Yichen Lu

Spin Coating Thick Resist, Joseph Song and Danielle Soberman

ABM Mask Aligner Video Tutorial, Joseph W. Song

Degassing PDMS, Joseph W. Song and Danielle Soberman

Developing SU8 Resist, Joseph W. Song and Danielle Soberman

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Heidelberg DWL66+ S1805 Contrast Curves, Steven Wood and Gerald G. Lopez

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Heidelberg DWL66+ S1813 Contrast Curves, Steven Wood and GERALD G. LOPEZ

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Heidelberg DWL66+ S1818 Contrast Curves, Steven Wood and GERALD G. LOPEZ

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MicroChem S1800 Series Resist Application onto Si, Steven Wood and GERALD G. LOPEZ

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SUSS MicroTec MA6 Gen3 – MicroChem SPR-220 7.0 Thickness vs. Dose-to-Clear and Contrast Curve Data, Steven Wood and Gerald G. Lopez

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Reactive Ion Etch (RIE) of Silicon and ZEP520A Resist Mask with Tetrafluoromethane (CF4) Using Oxford 80 Plus, Steven Wood, Gerald G. Lopez, and Meredith Metzler

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Directed Self-Assembly of Block Copolymer, No1, Hiromichi Yamamoto

Submissions from 2015

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Performance Check 1 on MA6 Mask Aligner, Jonathan Bryan

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PDMS-Glass Bonding Protocol - Technics, Ravit Dung and Justin Wen

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1. Dry Etching of SiO2, SiNx, and Si using 80plus Reactive Ion Etcher, Prashanth Gopalan

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PDMS-PDMS Bonding Protocol - Technics, Steven Henry

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KMPR Delamination Resistance Study Report, Steven Henry and Eric Johnston

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SU-8 Delamination Resistance Study Report, Steven Henry, Eric Johnston, and Justin Wen

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Photomask Defects Report, Steven Henry and Justin Wen

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Performance Check 1 on Elionix E-beam writer, Jisoo Kang

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Deep Silicon Etching using TRION, Zisong Nie

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Deposition Rate and Surface Roughness of Ti films prepared by Explorer14 Magnetron Sputterer, Zisong Nie

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Deposition Rate, Surface Roughness, Morphology, and Film Stress of Al films prepared by Explorer14 Magnetron Sputterer, Zisong Nie