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KOH etching of (100) Si wafer, No 2
(2016-09-02) Bajwa, Inayat
This report describes KOH etching of (100) Si wafer through a hard mask of silicon oxide, and reveals that the scattered etch rate is ascribed to the etch rates of the different crystal planes exposed during the etching.
Statistical Process Control of Alignment Module of NX2600
(2015-05-12) Yamamoto, Hiromichi
Surface Treatment and Adhesion Study
(2018-10-23) DeLessio, Maegan; Watson, Pat
In photolithography, it is often the case that the resist has difficulty adhering to a wafer due to its hydrophobic nature. The purpose of this study was to determine the best method for avoiding such adhesion problems. This study describes that four different surface treatments, (1) No bake before resist coating, (2) Bake at 115ºC before priming, (3) SURPASS coating, and (4) HDMS priming, are examined for UV lithography of sub-ten micron-sized lines and pillar arrays, and that HDMS vapor priming is the most effective surface treatment in promoting adhesion.
Suss MicroTec MA6 Mask Aligner Training: First Mask
(2019-09-09) Popoola, Ifeoluwa; Johnston, Eric D
Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Tetrafluoromethane (CF4)
(2016-05-07) Metzler, Meredith
This report discusses the CF4 etch process of SiNx using the Oxford 80 Plus RIE.
Statistical Process Control of 80plus Reactive Ion Etcher
(2015-05-06) Yamamoto, Hiromichi
IPG Green Laser Micromachining SOP
(2023-02-11) Johnston, Eric
SOP for the 532nm green laser located in QNF.
MicroChem S1800 Series Resist Application onto Si
(2016-02-18) Wood, Steven; LOPEZ, GERALD G
The Quattrone Nanofabrication Facility standard operating procedure for the application of MicroChem S1800 series resist onto an Si wafer is provided in this document.
Reactive Ion Etch (RIE) of Silicon and ZEP520A Resist Mask with Tetrafluoromethane (CF4) Using Oxford 80 Plus
(2016-05-12) Wood, Steven; Lopez, Gerald G; Metzler, Meredith
This report discusses the results of etching silicon with electron beam lithography defined features in ZEP520A resist using CF4 in the Oxford 80 Plus RIE.
LayoutEditor Training: 14 - Integrated Practice
(2019-11-19) Jones, David

Quattrone Nanofabrication Facility

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