Departmental Papers (MEAM)

Document Type

Journal Article

Date of this Version

October 2001

Comments

Copyright The American Ceramic Society. Reprinted from Bulletin of the American Ceramic Society, Volume 80, Issue 10, October 2001, pages 39-42.

Abstract

Focuses on the importance of ceramic tapes as a substrate material for hybrid microelectronic circuits. Fabrication of thermal reactor; Importance in monitoring temperature; Utilization of layered manufacturing and rapid prototyping processes.

Keywords

Ceramaic Materials, Industrial Applications, Microelectronics

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Date Posted: 06 November 2007