Evaluation of the GLINK Chip Set as a Data Link Layer for Local ATM

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dc.contributor.authorRusso, Chris
dc.date2023-05-17T00:59:06.000
dc.date.accessioned2023-05-22T12:54:35Z
dc.date.available2023-05-22T12:54:35Z
dc.date.issued1993-10-01
dc.date.submitted2007-07-17T09:37:12-07:00
dc.description.abstractThe introduction of the HDMP-1000 Gigabit Rate Transmit/Receive (GLINK) Chip Set by Hewlett-Packard has provided a hardware device capable of matching SONET STS-3c up to nearly STS-24c rates over either coaxial cable or optical fiber. The capability enables high speed local communication over a low cost medium, and lends itself well to use as both the physical and the data link layers for ATM in a local (few hundred feet) environment. This paper analyzes the capabilities of the GLINK chip set in terms of link length and data rate trade-offs, and in terms of its usefulness as a physical and DLL for local ATM.
dc.description.commentsUniversity of Pennsylvania Department of Computer and Information Science Technical Report No. MS-CIS-93-88.
dc.identifier.urihttps://repository.upenn.edu/handle/20.500.14332/7205
dc.legacy.articleid1299
dc.legacy.fulltexturlhttps://repository.upenn.edu/cgi/viewcontent.cgi?article=1299&context=cis_reports&unstamped=1
dc.source.issue291
dc.source.journalTechnical Reports (CIS)
dc.source.statuspublished
dc.titleEvaluation of the GLINK Chip Set as a Data Link Layer for Local ATM
dc.typeReport
digcom.contributor.authorRusso, Chris
digcom.identifiercis_reports/291
digcom.identifier.contextkey325416
digcom.identifier.submissionpathcis_reports/291
digcom.typereport
dspace.entity.typePublication
upenn.schoolDepartmentCenterTechnical Reports (CIS)
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