How to cleave wafers: LatticeGear protocol

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Protocols and Reports
Quattrone Nanofabrication Facility
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LatticeGear
wafer scribing
wafer cleaving
silicon fracture
Biological Engineering
Biomechanical Engineering
Electrical and Computer Engineering
Electrical and Electronics
Electromagnetics and Photonics
Electro-Mechanical Systems
Electronic Devices and Semiconductor Manufacturing
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Engineering Education
Engineering Science and Materials
Materials Science and Engineering
Mechanical Engineering
Nanotechnology Fabrication
Semiconductor and Optical Materials
Systems and Integrative Engineering
VLSI and Circuits, Embedded and Hardware Systems
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Abstract

We report on the process protocol to cleave wafers using LatticeGear cleaving and scribing tools sets.

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2021-02-10
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