Singh Center for Nanotechnology

The Singh Center is a next-generation nanotechnology center that merges traditional approaches to nanoscale development with unique state-of-the-art equipment, materials and ideas.

With a focus on innovation, the Singh Center is a hub for scientists and researchers that integrates state-of-the-art nanofabrication and nanocharacterization equipment to define new frontiers in nanotechnology. The Center boasts expert and experienced faculty and staff who are committed to the success of its users and interested in new approaches to realizing and implementing nanotechnology applications.

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Now showing 1 - 10 of 185
  • Publication
    KOH etching of (100) Si wafer, No 2
    (2016-09-02) Bajwa, Inayat
    This report describes KOH etching of (100) Si wafer through a hard mask of silicon oxide, and reveals that the scattered etch rate is ascribed to the etch rates of the different crystal planes exposed during the etching.
  • Publication
    Make and Characterize Microfluidic Devices with Gelatin: Do-it-yourself (DIY) Laboratory at Home
    (Singh Center for Nanotechnology, 2021-11-09) Youderian, Marissa; Song, Xilai; Lancaster, Mark; Jones, David J.; Jhamb, Ahana; Kim, Gyuseok L.
    Microfluidic devices have been fabricated with gelatin and paper clips. Optimization of fabrication and characterization process has been carried out systemically by varying gelatin-to-water ratio, bonding time and connector type. We find that the higher gelatin-to-water ratio and the luer lock syringe tip provide a greater success rate, whereas the influence of bonding time is limited. The Reynolds number was calculated to identify whether the fluid shows laminar or turbulent flow.
  • Publication
    ZEP520A Contrast Curves
    (2016-12-16) Lopez, Gerald G.; Azadi, Mohsen
    This report documents the contrast curves for the ZEP520A electron beam lithography resist from ZEON Chemicals. Dilution by weight of ZEP520A vs spin speed from 1000 to 6000 rpm was generated in previous work. The aim is to provide an approximate clearing and base dose for the ZEP520A standard process at the Singh Center for Nanotechnology.
  • Publication
    Statistical Process Control of Alignment Module of NX2600
    (2015-05-12) Yamamoto, Hiromichi
  • Publication
    Surface Treatment and Adhesion Study
    (2018-10-23) DeLessio, Maegan; Watson, Pat
    In photolithography, it is often the case that the resist has difficulty adhering to a wafer due to its hydrophobic nature. The purpose of this study was to determine the best method for avoiding such adhesion problems. This study describes that four different surface treatments, (1) No bake before resist coating, (2) Bake at 115ºC before priming, (3) SURPASS coating, and (4) HDMS priming, are examined for UV lithography of sub-ten micron-sized lines and pillar arrays, and that HDMS vapor priming is the most effective surface treatment in promoting adhesion.
  • Publication
    Suss MicroTec MA6 Mask Aligner Training: First Mask
    (2019-09-09) Popoola, Ifeoluwa; Johnston, Eric D
  • Publication
    Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Tetrafluoromethane (CF4)
    (2016-05-07) Metzler, Meredith
    This report discusses the CF4 etch process of SiNx using the Oxford 80 Plus RIE.
  • Publication
    Statistical Process Control of 80plus Reactive Ion Etcher
    (2015-05-06) Yamamoto, Hiromichi
  • Publication
    IPG Green Laser Micromachining SOP
    (2023-02-11) Johnston, Eric
    SOP for the 532nm green laser located in QNF.
  • Publication
    MicroChem S1800 Series Resist Application onto Si
    (2016-02-18) Wood, Steven; LOPEZ, GERALD G
    The Quattrone Nanofabrication Facility standard operating procedure for the application of MicroChem S1800 series resist onto an Si wafer is provided in this document.