The Quattrone Nanofabrication Facility (QNF), is an open access user facility that provides equipment resources and staff assistance for building devices and structures at the micro- and nanoscale. In addition to supporting academic research, we serve as a regional resource in welcoming all projects from other universities, industry and national laboratories.

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Submissions from 2017

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Inkjet Printing of Ag Nanoparticles using Dimatix Inkjet Printer, No 1, Amal Abbas and Inayat Bajwa

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Inkjet Printing of Ag Nanoparticles using Dimatix Inkjet Printer, No 2, Ming Yuan Chuang

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Characterization of Sputtering Copper Using the Denton Explorer-14 System, Roman Mays

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Characterization of Sputtering Platinum Using the Denton Explorer-14 System, Roman Mays

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Examination of the Stoney Equation and a Practical Determination of the Error in Residual Film Stress Measurements, Roman Mays

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The Measurement of Residual Film Stress in Deposited Thin Films Using the KLA-Tencor 2D/3D P7 Surface Profilometer, Roman Mays

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Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide (SiO2) Using Oxford Instruments System 100 PECVD, Meredith Metzler and Raj Patel

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Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Nitride (SiNx) Using Oxford Instruments System 100 PECVD, Meredith Metzler and Raj Patel

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Optimization of Plasma Enhanced Chemical Vapor Deposition (PECVD) of Amorphous Silicon (a-Si) Using Oxford Instruments System 100 with Taguchi L9 Based Design of Experiments (DOE), Raj Patel and Meredith Metzler

Submissions from 2016

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Spin Curves for MicroChem S1800 (1805, 1813, 1818) Series Positive Resist, Mohsen Azadi and Gerald G. Lopez

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Characterization of Silicon Deep Reactive Ion Etching Using the SPTS Rapier, Mohsen Azadi, Meredith Metzler, and Gerald G. Lopez

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Characterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIE, Mohsen Azadi, Meredith Metzler, and Gerald G. Lopez

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KOH etching of (100) Si wafer, No 1, Inayat Bajwa

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KOH etching of (100) Si wafer, No 2, Inayat Bajwa

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Metal Assisted Chemical Etching, Inayat Bajwa

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SUSS MicroTec MA6 Gen3 - S1805 Contrast Curve Data, Jonathan Bryan and GERALD G. LOPEZ

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SUSS MicroTec MA6 Gen3 - S1813 Contrast Curve Data, Jonathan Bryan, Steven Wood, and Gerald G. Lopez

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Self-Aligned Double Pattern, No1, Yinong Cao

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High Contrast 50kV E-Beam Lithography for HSQ atop Diamond using ESPACER for Spin-On Charge Dissipation, Richard R. Grote, Lee C. Bassett, and Gerald G. Lopez

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Presentation for Lab-on-a-Chip Seminar at QNF, Eric D. Johnston

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Torrey Pines Scientific Hotplate Calibration, GERALD G. LOPEZ

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ZEP520A Spin Curves and Dilution Characterization, Gerald G. Lopez Ph.D.

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Reactive Ion Etch (RIE) of Silicon Dioxide (SiO2) with Tetrafluoromethane (CF4), Meredith Metzler

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Reactive Ion Etch (RIE) of Silicon Dioxide (SiO2) with Trifluoromethane and Oxygen (CHF3/O2), Meredith Metzler

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Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Tetrafluoromethane (CF4), Meredith Metzler

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Reactive Ion Etch (RIE) of Silicon Nitride (SiNx) with Trifluoromethane and Oxygen (CHF3/O2), Meredith Metzler

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Atomic Layer Deposition (ALD) film characterization, Meredith Metzler and Yichen Lu

Spin Coating Thick Resist, Joseph Song and Danielle Soberman

ABM Mask Aligner Video Tutorial, Joseph W. Song

Degassing PDMS, Joseph W. Song and Danielle Soberman

Developing SU8 Resist, Joseph W. Song and Danielle Soberman

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Heidelberg DWL66+ S1805 Contrast Curves, Steven Wood and Gerald G. Lopez

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Heidelberg DWL66+ S1813 Contrast Curves, Steven Wood and GERALD G. LOPEZ

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Heidelberg DWL66+ S1818 Contrast Curves, Steven Wood and GERALD G. LOPEZ

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MicroChem S1800 Series Resist Application onto Si, Steven Wood and GERALD G. LOPEZ

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SUSS MicroTec MA6 Gen3 – MicroChem SPR-220 7.0 Thickness vs. Dose-to-Clear and Contrast Curve Data, Steven Wood and Gerald G. Lopez

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Reactive Ion Etch (RIE) of Silicon and ZEP520A Resist Mask with Tetrafluoromethane (CF4) Using Oxford 80 Plus, Steven Wood, Gerald G. Lopez, and Meredith Metzler

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Directed Self-Assembly of Block Copolymer, No1, Hiromichi Yamamoto

Submissions from 2015

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Performance Check 1 on MA6 Mask Aligner, Jonathan Bryan

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PDMS-Glass Bonding Protocol - Technics, Ravit Dung and Justin Wen

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1. Dry Etching of SiO2, SiNx, and Si using 80plus Reactive Ion Etcher, Prashanth Gopalan

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PDMS-PDMS Bonding Protocol - Technics, Steven Henry

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KMPR Delamination Resistance Study Report, Steven Henry and Eric Johnston

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SU-8 Delamination Resistance Study Report, Steven Henry, Eric Johnston, and Justin Wen

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Photomask Defects Report, Steven Henry and Justin Wen

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Performance Check 1 on Elionix E-beam writer, Jisoo Kang

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Deep Silicon Etching using TRION, Zisong Nie

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Deposition Rate and Surface Roughness of Ti films prepared by Explorer14 Magnetron Sputterer, Zisong Nie

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Deposition Rate, Surface Roughness, Morphology, and Film Stress of Al films prepared by Explorer14 Magnetron Sputterer, Zisong Nie

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Film Stress of Ti film prepared by PVD75 e-beam evaporator, Zisong Nie

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Growth rates and Pinholes of ALD SiO2, Al2O3, TiO2, and HfO2 films, Zisong Nie

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Surface Roughness and Morphology of Au film prepared by PVD75 e-beam evaporator, Zisong Nie

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Surface Roughness of ALD films, Zisong Nie

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Temperature dependence of ALD SiO2 growth, Zisong Nie

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Thickness and Permeability (against XeF2) of Parylene C film using Parylene Coater, Zisong Nie

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Al (confocal) deposition rate 1 using Explorer14 magnetron sputterer, Swapil Paliwal

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Deposition rate of Ti film prepared by Explorer14 magnetron Sputterer, Swapil Paliwal

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Thicknesses and Pinholes of SiO2, SiNx, and a-Si Films prepared by PECVD, No 1, Swapil Paliwal

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Film stress of Ti films prepared by Explorer14 Magnetron Sputterer, Swapil Paliwal and Zisong Nie

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Preparation of High Stress Silicon Nitride film using PECVD, Chia-Hsing Pi

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Atomic Layer Deposition-1, growth rate and uniformity of Al2O3, Dhruv Turakhia

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Deposition Rates 2 on PVD75 DC/RF Magnetron Sputterer, Dhruv Turakhia

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Deposition Rates 3 on PVD75 DC/RF Magnetron Sputterer, Dhruv Turakhia

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Deposition Rates on PVD75 Magnetron Sputterer, Dhruv Turakhia

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Thicknesses and Pinholes of SiO2, SiNx, and a-Si Films prepared by PECVD, No 2, Dhruv Turakhia

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Thickness Measurement on Ti, Au, Pd, and Cr using PVD75 E-beam Evaporator, Dhruv Turakhia

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2. Dry Etching of SiO2, SiNx, and Si using 80plus Reactive Ion Etcher, Meet Vora

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Channel Shape Study Report, Justin Wen

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KMPR Master Fabrication Protocol, Justin Wen

Layout Editor - User Interface, Justin Wen

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PDMS-Glass Bonding Protocol - Anatech, Justin Wen

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PDMS-PDMS Bonding Protocol - Anatech, Justin Wen

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Priming Methods for PDMS Devices Study Report, Justin Wen

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Stress Fracture Study Report, Justin Wen

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T-Topping Study Report, Justin Wen

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Standard Operating Procedures of Tools in Quattrone Nanofabrication Facility, Hiromichi Yamamoto

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Statistical Process Control of 80plus Reactive Ion Etcher, Hiromichi Yamamoto

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Statistical Process Control of Alignment Module of NX2600, Hiromichi Yamamoto

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Statistical Process Control of PECVD, Hiromichi Yamamoto

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Performance Check on ABM3000HR Mask Aligner, Lin Zhao and Prashanth Gopalan